LAPLACE's unique horizontal placement for large-size wafers

Since Q3 , most specialized wafer manufacturers have been mainly focusing on production of large-size wafers, while downstream cell and module manufacturers have been moving forward with the upgrade of their production lines to accommodate the market trend towards large-size, ultra-high-power modules. While the large-size wafer is in line with  current market developments, it also presents a greater challenge for existing equipment, especially thermal process equipment, in maintaining the capacity and uniformity of diffusion and coating despite the increase in size – one of the technical difficulties that equipment manufacturers need to overcome.

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LAPLACE has carried out research into thermal processes and supporting automated equipment for large-size and thin wafers since its establishment in . Based on theory and practice – the transition of semiconductor diffusion from 6″ to 8″ and from vertical to horizontal – LAPLACE has successively introduced horizontal low pressure diffusion (gaseous BCl3 boron diffusion and POCl3 phosphorus diffusion), oxidation and annealing furnaces and horizontal low pressure coating equipment (LPCVD). Low-pressure horizontal placement increases the free range of molecules, reducing gas turbulence and improving diffusion uniformity and stability, especially for large-size wafers and cells. Horizontal wafer placement also has less impact on airflow, allowing air to travel further, resulting in longer effective furnace tubes and greater capacity, increasing machine utilization and ensuring high capacity. The wafers are placed horizontally back-to-back, resulting in a tighter fit and less deformation at high temperatures, reducing winding diffusion. 

Based on its horizontal placement platform, LAPLACE has also developed low-pressure horizontal diffusion systems (including boron and phosphorus diffusion, oxidation and annealing), low-pressure chemical vapor deposition and plasma enhanced chemical vapor deposition, all fully validated by customers. 

The wafer oven is used to automatically bake wafer sheets into the desired shape from the prepared wafer dough. The furnace consists of a frame, mold, burner system, gas system, front extractor gear and rear tension systems.

The molds to international standards are heated with a heating system compatible with natural gas, liquefied gas or electricity. With the best heat dissipation and high thermal insulation, economical and efficient operation is ensured, as well as production without human contact with its fully automatic function.

Thanks to the servo-controlled air and gas system, a continuous, gentle and desired flame is provided. The baking time, which varies depending on the dough formula, the raw material, the thickness of the wafer plate, is ideally between 2 and 2:30 minutes.

Dough dispensing, dough transfer, baking system, leaf burrs and leaf removal functions are done automatically. Adjustments and interventions are done easily and quickly with the practical control panel. Flame control is done digitally from the control panel. Its equipments such as bulk dough pump, dough kneader, dough tank, dough transfer pumps are completely made of stainless material.

The sheet cooling machine is an environment preparation machine in which the baked wafer plate is automatically taken, cooled in the air environment and turned on. Sheet cooling consists of a stainless steel frame and wires carrying sheets, O-ring bands at the inlet and outlet.

In the sheet cooling machine, which works in harmony with the wafer oven and the next creamer spreader, the wafer sheets are taken out of the oven and the cooling input is carried out by a belt system.

The cooling output can be done manually or automatically.

Broken plates are separated at the entrance to the machine and stacking can be optionally performed at the exit.

The body of the wafer sheet cooling machine is made of aluminum and stainless steel.

The cream spreading machine turns the wafer into blocks by applying fluid and air cream of the desired thickness on the wafer sheets coming from the leaf cooling and stacking them on top of each other. The cream spreading machine consists of the main chassis, inlet group, feeding group, spreading group, layer group, joining group, hazelnut group, pressure group and upper group. Thanks to this machine, the process of applying cream and making blocks without touching the wafer leaves and cream is performed quickly and hygienically. The machine turns the wafer into blocks by applying cream on the wafer sheets coming from the leaf cooling and stacking them on top of each other.

• All sides of the machine are made of stainless steel.
• It is suitable for food codex.
• The liquid spreads the cream onto the wafer plate.
• It has the feature of adjusting the cream to the desired thickness.
• Printing feature with piston mechanism at the end of the exit band.
• Manual or automatic feeding feature.
• Floor thicknesses can be adjusted automatically.
• Wafer blocks are formed with the rotating folding feature.
• Automatic transition from leaf cooling is possible.
• It has a top plate overclock system.
• Continuous leaf spreading feature.
• The hot water system collects the waste cream and the automatic transfer machine system (jacketed), the waste cream transfer pumps are stainless.
• It has a stainless pan system that collects the pollution caused by wafer crumbs and dust.
• Under chassis rotating belt system that collects cream contamination.
• The cream pouring chamber is height adjustable.
• It has touch screen. The number of floors, speed settings, error signals and location can be easily adjusted through the screen.

The wafer block cooling machine is composed of special shelves with blocking rack, cooling unit, dehumidifying unit and lined covers insulated with polyurethane material.

The wafer block cooling machine is a special machine used to freeze cream and dry moisture before the cream coated wafer blocks (made up of layers of wafer and cream) enter the cutting machine.

It covers at least 50% less area than conveyor belt tunnels. It is very easy to set up and use. The refrigeration cabinet works with the control of the photocell located in the inlet strip. If the blocking of the wafer does not occur, it goes into standby mode after all the blockages inside are cleared. Thus, energy savings are achieved.

The cooling cabinet is controlled by PLC.

Are you interested in learning more about Automatic Wafer ( Horizontal ) Plating Machine? Contact us today to secure an expert consultation!

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The cooling power varies depending on the capacity and the dehumidification (drying) system.

By choosing a dual cooler system, the cream, which is still hot at the inlet, is cooled as quickly as possible and unwanted cream flow is avoided.

This is the cooler used to lower the creamy wafer blocks to certain temperatures with cooling systems.

It can be specially adjusted according to the capacity of the line.

The cooling capacity starts from at least 18,000 kcal / h and varies according to its capacity.

The product is transported by means of a steel metal tape suitable for feeding, which is wound in a spiral.

The belt speed works synchronously with the throughput of the production line.

The wafer cutting machine (whose product is specific to cooling systems) cuts cream coated wafer blocks into the desired dimensions either in blocks or individually.

The wafer blocks are perfectly cut in width and length.

The cutting machine includes a frame, cutting (1st and 2nd cutting), printing, power supply (1st and 2nd heating), layer group, tension group (soldier group), electrical panel and sheets where cutting waste is collected.

There is an automatic transition after the block cooling machine and a block rotation system before cutting.

The cooled insert blocks are brought to the most suitable cutting position selected by the rotator.

Manual or automatic feeding can be performed on the machine.

It is the machine used to cut between the wafers precut to the dimensions of the final product in the wafer cutting machine.

It ensures that the products are aligned before they enter the chocolate enrobing machine..

The plates aligned on the separation table are separated from each other by an intermediate opening strip.

It works in harmony with wafer cutting machine and chocolate enrobing machine.

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